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Base material type

Type PCBs Material Thickness in  mm
Singlesided FR4  0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Doublesided FR4  0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Material for multi-layer PCB FR4 ML  0.46; 0.61 ; 0.76
Singlesided on aluminium base IMS HA50  1.55

Production capabilities

Maximum dimensions of PCB: 368 x 518 mm, ML 236 x 396 mm
Maximum thickness of PCB: 3,2 mm
Minimum thickess of PCB: 0,4 mm
Minimum drilled hole: Ø 0,3 mm ; final plated throught hole Ø 0,2 mm
Aspect ratio: 1:5
Toleranc of plated throught holes: to Ø ? 2,0 mm: +/- 0,1 mm
2.0 mm < Ø ? 5.3 mm: +/- 0,15 mm
up to Ø 5,3 mm: +/- 0,2 mm
Maximum layers: 8

Conductor width (conductive pattern on outer layer of PCB)

Cooper thickness Min.conductor width Min. annular ring Final conductor tolerance
/µm/ /mm/ /mm/ /mm/
18 0.15 0.15 + 0.02 - 0.05
35 0.20 0.20 + 0.03 - 0.08
70 0.30 0.30 + 0.03 - 0.12

Conductor spacing (conductive pattern on outer layer)

Cooper thickness Minimum distance between conductors Final tolerance of distance between conductors
/µm/ /mm/ /mm/
18 0.15 + 0.05 - 0.02
35 0.20 + 0.08 - 0.02
70 0.25 + 0.12 - 0.03

Inner layer (Inner layer plating : Cu 35/35)

Minimum /mm
Distance between conductors: 0.20 DPS 1
Conductor width: 0.20 DPS 1
Annular ring: 0.23 DPS 1
Annular clearance PAD - Cu: 0.20 DPS 1
Annular clearance Drill - Cu: 0.40 DPS 1

Surface treatment

Thickness
Hal PB free: 2 - 40 µm
Immersion tin: 0.8 - 1.2 µm
Chemical Ni/Au: Ni- 5µm / Au - 0.1 µm

Solder mask

Addition to diameter of soldering pad: 0.10 mm
Addition to diameter of SMD pad: 0.10 mm
Min. width solder resist: 0.15 mm
Color standard - green
others - black, red, blue, white

Screen-printed legend

Cam engineers clear the legend 0.20mm back from the soldermask openings.
Minimum line width: 0.12 mm
Minimal font height: 1.5 mm
Minimal distance from solder mask: 0.2 mm
Legend design rules: DPS 1

Peelable protective mask

Hole covering: Maximum diameter: 2.0 mm
Solder pad covering: ≥ 0.4 mm Addition to soldering pad diammeter
Distance between protective mask and pad: ≥ 0.6 mm
Distance between prot. mask and PCB edg: ≥ 0.6 mm

Carbon print

Conductor width: Minimum 0.4 mm
Clearance width (isolation gap) Minimum 0.4 mm
Contact pad coverage: Minimum 0.1 mm (addition to the pad edge)

Final treatment

Routing: tol. +/-0,2 mm
V - cutting: tol. +/-0,2 mm

work

Compliance with the design rule check, reducing the risk of error in the production and accelerates the process of confirmation. From long experience in the manufacture of circuit boards we know that most errors occur at just the wrong PCBs desing.

Production data

info

Customer is responsible for the correct data resources needed to produce the PCB (Data for plotting, drilling and milling files, drawings, etc.)

Odb++ files - Currently the best format containing more information about SMD, plated and unplated holes, electrical netlist for testing, operator texts, etc.

GERBER RS274-X - Most widely used format today, and many design programs can export in this format. The advantage is that the file contains the D-code.

GERBER RS274-D - Older versions, you must attach a separate D-Code file.

EAGLE BRD – *.brd file can be applied directly as the source file. All exports will transfer normaly. Any exceptions (in the used layers) must be specified. The exported files are sent to the customer for approval in the gerber file 274-X and PDF for approval.

Drill and mill data -accepted formats: EXCELLON, Sieb & Meyer 1000, Sieb & Meyer 3000 (Preferably, the export format - units, decimals and zero suppression + info drill report). Averages defined in info file or directly in drill files are considered as final diameter (after galvanisation), meaning that holes will be drilled with tools 0.1mm diameter larger. If non-plated holes are not defined, all holes with the same diameter of pads and hole or without pads are considered non-plated and they are automatically moved to the layer for non-plated drilling. We must be noticed about the drilling with controlled Z axis!

info

Standard coating is curtain green solder resist. Other colors - according to customer requirements, black, red, white and blue, are applied by screen printing. For materials with a thickness over 105 microns clad copper, solder resist is applied 2 times on each side of pcb. The minimum thickness of solder resist at the conductors edge is over 10 um. Mis-registration to the conductive image +/- 50 microns. Solder resist should not be too big to uncover ground around SMD pads.