full screen background image

Base material

PCB type Material Thickness in mm
Siglesided FR4  0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Doublesided FR4  0.4 ; 0.6 ; 0.8 ; 1.0 ; 1.2 ; 1.55 ; 2.0; 2.4; 3.0; 3.2
Material for multi-layer PCB FR4 ML  0.46; 0.61 ; 0.76
Singlesided on aluminium base IMS HA50  1.55

Production capabilities

Maximum dimensions of PCB: 368 x 518 mm, ML 236 x 396 mm
Maximum thickness of PCB: 3,2 mm
Minimum thickess of PCB: 0,4 mm
Minimum drilled hole: Ø 0,3 mm ; final plated throught hole Ø 0,2 mm
Aspect ratio: 1:5
Toleranc of plated throught holes: do Ø ≤ 2,0 mm: +/- 0,1 mm
2.0 mm < Ø ≤ 5.3 mm: +/- 0,15 mm
up to Ø 5,3 mm: +/- 0,2 mm
Maximum layers: 8

Conductor width (conductive pattern on outer layer of PCB)

Cooper thickness Min.conductor width Min. annular ring Final conductor tolerance
/µm/ /mm/ /mm/ /mm/
18 0.15 0.15 + 0.02 - 0.05
35 0.20 0.20 + 0.03 - 0.08
70 0.30 0.30 + 0.03 - 0.12

Conductor spacing (conductive pattern on outer layer)

Cooper thickness Minimum distance between conductors Final tolerance of distance between conductors
/µm/ /mm/ /mm/
18 0.15 + 0.05 - 0.02
35 0.20 + 0.08 - 0.02
70 0.25 + 0.12 - 0.03

Inner layer  (Inner layer plating : Cu 35/35)

Minimum /mm
Distance between conductors: 0.20 DPS 1
Conductor width: 0.20 DPS 1
Annular ring: 0.23 DPS 1
Annular clearance PAD - Cu: 0.20 DPS 1
Annular clearance Drill - Cu: 0.40 DPS 1

Surface treatment

Thickness
Hal PB free: 2 - 40 µm
Immersion tin: 0.8 - 1.2 µm
Chemical Ni/Au: Au - 0.1 µm

Solder mask

Addition to diameter of soldering pad: 0.10 mm
Addition to diameter of SMD pad: 0.10 mm
Min. width solder resist: 0.15 mm
Color standard - green
other - black, red, blue, white

Screen-printed legend

Cam engineers clear the legend 0.20mm back from the soldermask openings.
Minimum line width: 0.12 mm
Minimal font height: 1.5 mm
Minimal distance from solder mask: 0.2 mm
Legend design rules: DPS 1

Peelable protective mask

Hole covering: Maximum diameter: 2.0 mm
Solder pad covering: ≥0.4 mm Addition to soldering pad diammeter
Distance between protective mask and pad: ≥ 0.6 mm
Distance between prot. mask and PCB edg: ≥ 0.6 mm

Carbon print

Conductor width: Minimum 0.4 mm
Clearance width (isolation gap) Minimum 0.4 mm
Contact pad coverage: Minimum 0.1 mm (addition to the pad edge)

Final treatment

Routing: tol. +/-0,2 mm
V - cutting: tol. +/-0,2 mm
UL google+ youtube

© 2018 ZVT-PRINT, a.s. | General Purchase Conditions | Privacy policy